Análise das evidências científicas publicadas sobre a relação existente entre infecção de feridas e cicatrização quanto aos microrganismos e tratamento tópico

Abstract

Introduction: Wound infection is seen as one of the main health problems. It happens due to the presence of microorganism that damages the tissue, making the healing process of the wound deficient. Therefore, the implementation of an effective topical treatment in the occurrence of wound infection is essential with a view to healing. Objective: To analyze the published scientific evidence on the relationship between wound infection and healing, in terms of microorganisms and topical treatment. Methodology: Integrative review study, through scientific literature research in the electronic databases MEDLINE, Virtual Health Library (VHL), EMBASE, SCOPUS, WEB OF SCIENCE, Scientific Electronic Library Online (SciELO) and Latin American and Caribbean Literature in Health Sciences (LILACS) using descriptors "Wound Healing", Microbiota, "Wound Infection", "Anti-Infective Agents, Local". Results: In the time frame from 2017 to 2022, 14 articles that met the search criteria were selected. All articles point to wound infection negatively interfering in the healing process and mention the microorganisms Staphylococcus aureus and Pseudomonas aeruginosa, mainly in the form of biofilm, as more present in this event.As for the most studied topical treatments, silver appears in 28.6%, followed by formulations with iodine eat in 21.4%, use of probiotics (14.3%) as an alternative to antimicrobials, methylene blue (14.3%) and sodium hypochlorite (7.1%), along with calcium oxide (7.1%), gentian violet (7.1%) and herbal medicines (7.1%). Conclusion: Despite the studies already published on the subject, we identify the need for studies that establish the efficacy and safety of products in humans, mainly due to the scarcity of high-evidence publications in this sense. In addition to research aimed at the development of antimicrobial therapies that do not cause resistance.